ATPG targets faults at IC-gate boundaries, but 50% of defects are located within cells. Learn how cell-aware ATPG and user-defined fault models help to ferret out these hard-to-squash bugs.

Early results of using device-aware testing on alternative memories show expanded test coverage, but this is just the start. Once the semiconductor industry realized that it was suffering from device ...

Rotating machinery, including critical components such as gears, bearings, and planetary systems, serves as the backbone of modern industrial equipment, ...

The AI model rapidly maps boundary conditions to molecular alignment and defect locations, replacing hours of simulation and enabling fast exploration and inverse design of advanced optical materials.

Key components that semiconductor manufacturers must consider in advanced packaging. Challenges in advanced packaging, particularly in defect analysis and die-level fault isolation. New technologies ...

Defect engineering is the deliberate introduction, removal, or manipulation of structural imperfections in nanomaterials to tailor their properties for specific applications. Unlike the traditional ...

Engineering teams are wrestling with how to identify the root causes of silent data corruption (SDC) in a timely and cost-effective way, but the solutions are turning out to be broader and more ...