The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...

The next phase of artificial intelligence is no longer just about faster GPUs. As AI moves from single-task generation to autonomous, multi-step "agentic" systems, the economic value is migrating to ...